ETTEPLAN ISSUES EUR 10 MILLION HYBRID BOND

ETTEPLAN ISSUES EUR 10 MILLION HYBRID BOND


Etteplan Oyj has resolved to issue a EUR 10 million hybrid bond. The coupon
rate of the bond is 9.50% per annum. The bond has no maturity but the company
may call the bond after two years. The bond was sold to a limited number of
investors. 

The bond strengthens Group's capital structure and the arrangement provides
prerequisites for expanding the business among others with company
acquisitions. 

Hybrid bond is a bond which is subordinated to the company's other debt
obligations and treated as equity in the IFRS financial statements. Hybrid
bonds do not confer to holders the right to vote at shareholder meetings and do
not dilute the holdings of the current shareholders. 

Sofia Bank acted as the sole bookrunner and Etteplan's financial advisor in the
arrangement. 


Hollola, November 18, 2009


Etteplan Oyj
Group Communications


Additional information: 
Matti Hyytiäinen, President & CEO, tel. +358 400 710 968


DISTRIBUTION:
Nasdaq OMX Helsinki
Major media
www.etteplan.com

Etteplan is a specialist in industrial equipment engineering and technical
product information solutions and services. Our customers are global leaders in
their fields and operate in areas like the automotive, aerospace and defence
industries as well as the electricity generation and power transmission
sectors, and material flow management. 

Etteplan has comprehensive competence in electronics and embedded systems
development, automation and electrical design, mechanical design and technical
product information solutions and services. 

Etteplan's strength lies in its highly skilled employees who, being located
near to the customers, are able to develop close, long term business
relationships. We implement solutions globally according to customer needs. 

In 2008, Etteplan had turnover of EUR 135.3 million. The company currently has
approximately 1,700 employees. Etteplan's shares are listed on NASDAQ OMX
Helsinki Ltd under the ETT1V ticker.