ETTEPLAN CONSIDERS ISSUANCE OF HYBRID BONDS
Stock exchange release – Published: 16.11.2009 9:30:00
ETTEPLAN CONSIDERS ISSUANCE OF HYBRID BONDS Etteplan Oyj is considering the issuance of hybrid capital bonds. The potential issue is expected to be launched in the near future subject to market conditions. The targeted size of the issue is approximately EUR 10 million. Sofia Bank is the sole bookrunner of the potential issue and Etteplan's financial adviser in the arrangement. Hybrid bond is a bond that is subordinated to the company's other debt obligations and treated as equity in the IFRS financial statements. Hybrid bonds do not confer to holders the right to vote at shareholder meetings and do not dilute the holdings of the current shareholders. Hollola, November 16, 2009 Etteplan Oyj Group Communications Additional information: Matti Hyytiäinen, President and CEO, tel. +358 400 710 968 DISTRIBUTION: NASDAQ OMX Helsinki Major media www.etteplan.com Etteplan is a specialist in industrial equipment engineering and technical product information solutions and services. Our customers are global leaders in their fields and operate in areas like the automotive, aerospace and defence industries as well as the electricity generation and power transmission sectors, and material flow management. Etteplan has comprehensive competence in electronics and embedded systems development, automation and electrical design, mechanical design and technical product information solutions and services. Etteplan's strength lies in its highly skilled employees who, being located near to the customers, are able to develop close, long term business relationships. We implement solutions globally according to customer needs. In 2008, Etteplan had turnover of EUR 135.3 million. The company currently has approximately 1,700 employees. Etteplan's shares are listed on NASDAQ OMX Helsinki Ltd under the ETT1V ticker.
